CMP Slurry

Oxide CMP Slurries include ACESOL 2580, 2012, and 1280. These ACESOL Oxcide CMP Slurries offer a complete solution for your polishing requirements based on the latest colloidal silica technology showing exceptional stability and high manufacturing reproducibility.

Wafer Polishing Slurry

ACESOL Wafer Edge, Wafer Backside, Wafer Stock Polishing Slurries. The list of products include ACESOL WP 2010(a wafer edge polishing slurry), 110H (a wafer stock slurry), BP40 (a wafer back side polishing slurry), and 3040 (a wafer stock polishing slurry).

Industrial Applications of Slurries

The examples of main applications include refractory binder, coating vehicle, food additive and etc. The production models contain SILIFOG 30AK, 45AK, 20NS, Special Grade, and the Abrasive Silica. One of the production models, Abrasive Silica is the raw materialed colloidal silica that is used as a polishing slurry.
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