ACESOL^®(CMP Polishing Slurry)

Name	Contents	Dilution	pH	Remark
ACESOL1280	12%	RTU	11.0	ILD, IMD, STI, BUFFING
ACESOL2580	25%	1 : 1	11.0	ILD, IMD, STI, BUFFING
ACESOL3300	33%	1 : 2	10.8	High RR, high diluted & low POU price

Characteristics

• Main Component: DIW & Abrasive
• Raw material: Sodium silicate (Na₂O·3SiO₂)
• Process: Liquid Phase
• Particle: Unique particle
• Merit: Low scratch and low CoO

Application

• Oxide CMP polishing slurry
• Process: ILD, IMD , STI CMP

ACE NANOCHEM CO.,LTD    CEO : Jong Hoon Lee
[Youngchun Plant(Head Office)]
217, Yeongcheonsandan-ro, Geumho-eup, Youngchun-Si, Kyungsangbuk-Do Tel.82-54-334-6240 Fax.82-54-334-6849
[Kyungsan Plant]
33, Jaingongdan-ro, Jain-myeon Kyungsan-Si, Kyungsangbuk-Do Tel.82-53-857-6240 Fax.82-53-856-6849

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